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    • Inorganic filler-filled epoxy adhesive for electronic packaging application 

      แซ่ซื้อ, ชุติพงศ์; สมหวังธนโรจน์, อนงค์นาฏ (2015-06-05)
      As the high performance electronic devices are required, the better heat dissipation in electronic packaging is necessary. In this work, the thermal diffusivity of epoxy-based adhesive used as an underfill material in ...