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dc.contributor.authorNawarat, Poomiraten_US
dc.contributor.authorภูมิรัตน์ นวรัตน์en_US
dc.date.accessioned2023-04-02T11:10:17Z
dc.date.available2023-04-02T11:10:17Z
dc.date.issued2023-04-02
dc.identifier.urihttp://repository.rmutp.ac.th/handle/123456789/4052
dc.descriptionรายงานวิจัย -- มหาวิทยาลัยเทคโนโลยีราชมงคลพระนคร, 2564en_US
dc.description.abstractThe attempt to fabricate gold films on glass slide (Au/glass) and silicon wafer (Au/Si) with gold leaf was unsuccessful due to poor adhesion between the gold leaf and substrates. Alternatively, Au/glass and Au/Si films were fabricated by placing the substrate into the free space within sputtering chamber to collect the access Au vapor during the typical sputtering process for other samples. In this study, the physical changes were observed in both Au/glass and Au/Si film under the film annealing from 300⁰C-700⁰C. The visual inspection via cell phone camera, the micrograph via Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) revealed the morphological changes with respect the annealing temperature in Au films due to solid state dewetting mechanism. The changes were more pronounce in Au/glass films than Au/Si films at the same annealing temperature. The X-ray diffraction measurement three phases of Au including Au(111), Au(200), and Au(220) in Au/glass films and one phase of Au(111) in Au/silicon films. The concentration and single crystallinity of Au(111) were increased with respect to annealing temperature in Au/glass film. For Au/Si films, the concentration and single crystallinity of Au(111) were decreased at 300⁰C and then were increased at 700⁰C, respectively. The physical changes of Au films are likely due to the movement of Au atoms via solid state dewetting and recrystallization. The heat intake from annealing process is likely induced the dewetting process by increasing the kinetic energy of Au atoms. While the recrystallization process is likely occur during the cooling period of the samples. Finally, another factor that can affects the physical changes of Au films is the interface interaction between Au films and substrates.en_US
dc.description.sponsorshipRajamangala University of Technology Phra Nakhonen_US
dc.language.isothen_US
dc.subjectSolidsen_US
dc.subjectของแข็งen_US
dc.subjectHeaten_US
dc.subjectความร้อนen_US
dc.subjectGold filmen_US
dc.subjectฟิล์มทองen_US
dc.subjectGold leafen_US
dc.subjectทองคำเปลวen_US
dc.subjectAtomsen_US
dc.subjectอะตอมen_US
dc.titleMechanism of atomic transport on gold film fabricated by gold leafen_US
dc.title.alternativeการศึกษากลไกการเคลื่อนตัวของทองในระดับอะตอม ในการเปลี่ยนโครงสร้างทางพื้นผิวของฟิล์มทองที่ผลิตจากทองคำเปลวen_US
dc.typeResearch Reporten_US
dc.contributor.emailauthorpoomirat.n@rmutp.ac.then_US
dc.contributor.emailauthorarit@rmutp.ac.then_US


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