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dc.contributor.authorแซ่ซื้อ, ชุติพงศ์
dc.contributor.authorสมหวังธนโรจน์, อนงค์นาฏ
dc.date.accessioned2015-06-05T02:26:56Z
dc.date.available2015-06-05T02:26:56Z
dc.date.issued2015-06-05
dc.identifier.urihttp://repository.rmutp.ac.th/handle/123456789/1705
dc.descriptionวารสารวิชาการและวิจัย มทร.พระนคร, ฉบับพิเศษ : 205-212en_US
dc.description.abstractAs the high performance electronic devices are required, the better heat dissipation in electronic packaging is necessary. In this work, the thermal diffusivity of epoxy-based adhesive used as an underfill material in electronic packaging can be improved by adding nano-sized inorganic fillers. These fillers including aluminum oxide (Al2O3), silicon nitride (Si3N4) and silicon carbide (SiC) were used alone for preparing particulate filled-epoxy adhesive. Furthermore, In order to achieve good dispersion of filler in matrix, the adhesive’s preparation process was adjusted. The maximum loading of fillers in adhesive were determined by the homogeneity of filler and matrix. In addition, to avoid the agglomeration of filler, silane coupling agent was treated onto surface of aluminum oxide filler to improve interfacial interaction between filler and epoxy resin. The effects of the filler type and filler’s loading on the thermal diffusivity of adhesive were investigated using Laserflash.en_US
dc.description.sponsorshipRajamangala University of Technology Phra Nakhonen_US
dc.language.isothen_US
dc.subjectthermal conductivityen_US
dc.subjectการนำความร้อนen_US
dc.subjectinorganic filleren_US
dc.subjectสารตัวเติมอนินทรีย์en_US
dc.subjectepoxy adhesiveen_US
dc.subjectกาวอีพอกซีen_US
dc.titleInorganic filler-filled epoxy adhesive for electronic packaging applicationen_US
dc.typeJournal Articlesen_US
dc.contributor.emailauthorchutiphong_sae-sue@hotmail.comen_US
dc.contributor.emailauthorarit@rmutp.ac.th


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